At the Open Compute Project (OCP) U.S. Summit 2018, Artesyn Embedded Technologies will showcase its power solutions for hyperscale and cloud computing data centers, which focus on optimizing efficiency and power density from the power cord to the chip.
Artesyn has announced two new models in its ADO300 series 300W eighth-brick converters, providing single 3.3V or 5V outputs.
The CSU800AP is housed in a compact 1U high enclosure measuring just 2.89 x 7.28 inches (73.5 x 185.0 mm) – a significantly smaller footprint than that of similarly rated earlier generation power supplies – achieved by using the latest power switching technology and high density component packaging techniques.
Collon Lee, Artesyn’s Vice President of Global Technical Support, spoke with EE Times Japan about the power requirements for medical and industrial applications. He discusses the benefits of configurable, modular AC-DC power supplies including Artesyn’s MicroMP (uMP) and Intelligent High Power (iHP) systems. Collon also introduces the advantages to customers of using digital control in power supplies.
Both families consist of fully regulated single 5, 12 and 15 V single output models and +12/-12 and +15/-15 V dual output models.
Provides the high efficiency and thermal performance demanded by telecom network and data center equipment
Three new series of external power adapters will enable OEMS to meet the latest Level VI efficiency standards, which aim to reduce waste energy from external power supplies both from no-load and normal operation and target a range of applications including consumer electronics, office equipment, industrial products and medical devices.