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    Location: Santa Clara, CA USA

    Venue: Santa Clara Convention Center

    Artesyn Embedded Technologies' Chief Architect Doug Sandy, will be speaking on a panel during the OCP US Summit 2017.  

    Thursday, March 9 • 10:00am - 10:25am
    Panel: Power Considerations for Open Rack
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    Location: Shanghai New International Expo Centre (SNIEC)

    Venue: Hall E4 Booth 4600

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    Location: Seoul, Korea

    Venue: Coex

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    Location: Chengdu, China

    Venue: Chengdu Century City New International Convention & Exhibition Center

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    Location: New Delhi, India

    Venue: Pragati Maidan, booth 2185