MaxCore™ High Availability PlatformHigh Availability Compute & Media Platform

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MaxCore™ High Availability Platform

Today’s networks demand higher bandwidth and lower latency that ever before. And with the emergence of Mobile Edge Computing (MEC) and the promise of new applications enabled by 5G operators need high availability, low latency platforms at the edge of their networks. As an example, for new network components like the cloud/virtualized radio access network (c/vRAN) its critical to enable more versatile, less expensive network components while maintaining the requirements of communications infrastructure such as reliability and high availability. The Artesyn MaxCore™ High Availability (HA) platform – built around the Intel® Xeon® D processor family – creates an unprecedented level of both density and versatility when building virtualized high-availability applications. The MaxCore HA platform has up to 352 processor cores per system and up to 400G ingress/ egress support. 


  • Standard PCI Express card integration through hot swappable card carrier
  • Hot swap and redundancy maximizes system uptime
  • Small footprint (just 450 mm depth) ensures global equipment practice compatibility
  • High density minimizes both CapEx and OpEx costs


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  • Redundant intelligent 100G and more network I/O enables flexible, programmable packet forwarding
  • Supports Intel FlexRAN 

  • Microserver and switch cards with up to 352 Intel® Xeon® processor D cores per system
  • Full SDN/NFV packet forwarding and virtualization support enables seamless scaling
  • Hot pluggable PCI Express cards for compute and I/O
  • Redundant AC and DC power options
  • Telecom Clocking infrastructure
  • Designed for 19” racks in NEBS/ETSI environments
  • PCI ExpressFabric built-in infrastructure
  • Multiple system configurations: up to six “standard server plus PCI Express I/O card” combinations or a mix of microservers and I/O cards with PCI Express shared I/O technology 

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