Centellis® 2100 SeriesAdvancedTCA Platform Core

The Artesyn Embedded Technologies Centellis® 2100 platform core is a high availability platform ideally suited for data intensive, central office and enterprise networking applications. The low profile makes the Centellis 2100 the optimal candidate for distributed networking functions, low density subscriber areas, or specialized applications. Target applications include security and DPI applicances, distributed control plane functions, IMS/IPTV subsystems, 4G wireless applications, and edge networking and routing.

With power and cooling support for up to 400 W per slot and up to 500 W in a single slot configuration, the new Centellis 2100 enables systems integrators to increase performance and I/O bandwidth per slot, while preparing for future performance upgrades that will have increasing power and cooling requirements. Designed to meet NEBS and ETSI environmental requirements, the Centellis 2100 features front-to-rear cooling, and is designed to meet and exceed the stringent Communications Platform Trade Association (CP-TA) B.4 thermal profile.

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  • Two-slot, 3U, 19” form factor (horizontal slots) 
  • Targeted for central office and data center environments 
  • Up to 400 W per slot power and cooling 
  • NEBS compliant front-to-rear enhanced cooling 
  • Integrated shelf management and Base switching infrastructure 
  • Direct cross-connect circuitry for the Fabric Interface (1G/10G/40G) 
  • AC and DC power configurations available 
  • Two user slots for OEM customization 
  • RoHS 6/6 compliant 
  • Designed for NEBS/ETSI compliance (DC variants only)